Roadmapping of Nanoelectronics for the New Electronics Industry

Roadmapping of Nanoelectronics for the New Electronics Industry

Blog Article

This paper is dedicated to a review of the international effort to map the future of nanoelectronics Kick Panel End Caps from materials to systems for the new electronics industry.The following sections are highlighted: the Roadmap structure with the international teams, the methodology and historical evolution, the various eras of scaling, the new ecosystems and computer industry, the evolving supply chain, the development of SoC and SiP, the advent of the Internet of Everything and the 5G communications, the dramatic increase of data centers, the power challenge, the Covered Casserole technology fusion, heterogeneous and system integration, the emerging technologies, devices and computing architectures, and the main challenges for future applications.